Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer

ABSTRACT

A method for fabricating semiconductor device is disclosed. First, a substrate is provided, in which the substrate includes a first metal gate and a second metal gate thereon, a first hard mask on the first metal gate and a second hard mask on the second metal gate, and a first interlayer dielectric (ILD) layer around the first metal gate and the second metal gate. Next, the first hard mask and the second hard mask are used as mask to remove part of the first ILD layer for forming a recess, and a patterned metal layer is formed in the recess, in which the top surface of the patterned metal layer is lower than the top surfaces of the first hard mask and the second hard mask.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a continuation application of U.S. patent application Ser. No.14/494,607, filed on Sep. 24, 2014, and all benefits of such earlierapplication are hereby claimed for this new continuation application.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a semiconductor device, and more particularlyto a semiconductor device having high-resistance metal layer embeddedwithin an interlayer dielectric (ILD) layer.

2. Description of the Prior Art

With the trend in the industry being towards scaling down the size ofthe metal oxide semiconductor transistors (MOS), three-dimensional ornon-planar transistor technology, such as fin field effect transistortechnology (FinFET) has been developed to replace planar MOStransistors. Since the three-dimensional structure of a FinFET increasesthe overlapping area between the gate and the fin-shaped structure ofthe silicon substrate, the channel region can therefore be moreeffectively controlled. This way, the drain-induced barrier lowering(DIBL) effect and the short channel effect are reduced. The channelregion is also longer for an equivalent gate length, thus the currentbetween the source and the drain is increased. In addition, thethreshold voltage of the fin FET can be controlled by adjusting the workfunction of the gate.

However, integration of metal gate and thin film resistor still facessome issues in conventional FinFET fabrication, such as directpenetration of contact plugs through thin film resistor due to poorlocation of thin film resistor thereby affecting the performance of theresistor. Hence, how to improve the current FinFET fabrication andstructure has become an important task in this field.

SUMMARY OF THE INVENTION

According to a preferred embodiment of the present invention, a methodfor fabricating semiconductor device is disclosed. First, a substrate isprovided, in which the substrate includes a first metal gate and asecond metal gate thereon, a first hard mask on the first metal gate anda second hard mask on the second metal gate, and a first interlayerdielectric (ILD) layer around the first metal gate and the second metalgate. Next, the first hard mask and the second hard mask are used asmask to remove part of the first ILD layer for forming a recess, and apatterned metal layer is formed in the recess, in which the top surfaceof the patterned metal layer is lower than the top surfaces of the firsthard mask and the second hard mask.

According to another aspect of the present invention, a semiconductordevice includes: a substrate; a first metal gate on the substrate; afirst hard mask on the first metal gate; an interlayer dielectric (ILD)layer on top of and around the first metal gate; and a patterned metallayer embedded in the ILD layer, in which the top surface of thepatterned metal layer is lower than the top surface of the first hardmask.

These and other objectives of the present invention will no doubt becomeobvious to those of ordinary skill in the art after reading thefollowing detailed description of the preferred embodiment that isillustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-6 illustrate a method for fabricating semiconductor deviceaccording to a preferred embodiment of the present invention.

FIG. 7 illustrates a structural view of a semiconductor device accordingto an embodiment of the present invention.

DETAILED DESCRIPTION

Referring to FIGS. 1-6, FIGS. 1-6 illustrate a method for fabricatingsemiconductor device according to a preferred embodiment of the presentinvention. Despite this embodiment pertains to a non-planar transistorfabrication process, the embodiment could be applied to both planar andnon-planar transistor fabrication process. As shown in FIG. 1, asubstrate 12, such as a silicon substrate or silicon-on-insulator (SOI)substrate is provided, and a transistor region, such as a PMOS region ora NMOS region is defined on the substrate 12. At least a firstfin-shaped structure 14 and an insulating layer 16 are formed on thesubstrate 12, in which the bottom of the fin-shapes structure 14 ispreferably enclosed by the insulating layer 16, such as silicon oxide toform a shallow trench isolation (STI). A plurality of metal gates 18,20, 22 are formed on part of the fin-shaped structure 14.

The formation of the fin-shaped structure 14 could be accomplished byfirst forming a patterned mask (now shown) on the substrate, 12, and anetching process is performed to transfer the pattern of the patternedmask to the substrate 12. Next, depending on the structural differenceof a tri-gate transistor or dual-gate fin-shaped transistor beingfabricated, the patterned mask could be stripped selectively orretained, and deposition, chemical mechanical polishing (CMP), andetching back processes are carried out to form an insulating layer 16surrounding the bottom of the fin-shaped structure 14. Alternatively,the formation of the fin-shaped structure 14 could also be accomplishedby first forming a patterned hard mask (not shown) on the substrate 12,and then performing an epitaxial process on the exposed substrate 12through the patterned hard mask to grow a semiconductor layer. Thissemiconductor layer could then be used as the corresponding fin-shapedstructure 14. In another fashion, the patterned hard mask could beremoved selectively or retained, and deposition, CMP, and then etchingback could be used to form an insulating layer 16 to surround the bottomof the fin-shaped structure 14. Moreover, if the substrate 12 were a SOIsubstrate, a patterned mask could be used to etch a semiconductor layeron the substrate until reaching a bottom oxide layer underneath thesemiconductor layer to form the corresponding fin-shaped structure. Ifthis means is chosen the aforementioned steps for fabricating theinsulating layer 16 could be eliminated.

The fabrication of the metal gates 18, 20, 22 could be accomplished by agate first process, a high-k first approach from gate last process, or ahigh-k last approach from gate last process. Since this embodimentpertains to a high-k first approach, dummy gates (not shown) composed ofhigh-k dielectric layer and polysilicon material could be first formedon the fin-shaped structure 14 and the insulating layer, and a spacer 24is formed on the sidewall of the dummy gates. A source/drain region 26and epitaxial layer 28 are then formed in the fin-shaped structure 14and/or substrate 12 adjacent to two sides of the spacer 24, a contactetch stop layer (CESL) 30 is formed on the dummy gates, and aninterlayer dielectric (ILD) layer 32 composed of tetraethylorthosilicate (TEOS) is formed on the CESL 30.

Next, a replacement metal gate (RMG) process could be conducted toplanarize part of the ILD layer 32 and CESL 30 and then transforming thedummy gates into metal gates. The RMG process could be accomplished byfirst performing a selective dry etching or wet etching process, such asusing etchants including ammonium hydroxide (NH₄OH) ortetramethylammonium hydroxide (TMAH) to remove the polysilicon layerfrom dummy gates for forming a recess (not shown) in the ILD layer 32.Next, a conductive layer including at least a U-shaped work functionmetal layer 34 and a low resistance metal layer 36 is formed in therecess, and a planarizing process is conducted so that the surfaces ofthe U-shaped work function layer 34 and low resistance metal layer 36are even with the surface of the ILD layer 32.

In this embodiment, the work function metal layer 34 is formed fortuning the work function of the later formed metal gates to beappropriate in an NMOS or a PMOS. For an NMOS transistor, the workfunction metal layer 34 having a work function ranging between 3.9 eVand 4.3 eV may include titanium aluminide (TiAl), zirconium aluminide(ZrAl), tungsten aluminide (WAl), tantalum aluminide (TaAl), hafniumaluminide (HfAl), or titanium aluminum carbide (TiAlC), but it is notlimited thereto. For a PMOS transistor, the work function metal layer 34having a work function ranging between 4.8 eV and 5.2 eV may includetitanium nitride (TiN), tantalum nitride (TaN), tantalum carbide (TaC),but it is not limited thereto. An optional barrier layer (not shown)could be formed between the work function metal layer 34 and the lowresistance metal layer 36, in which the material of the barrier layermay include titanium (Ti), titanium nitride (TiN), tantalum (Ta) ortantalum nitride (TaN). Furthermore, the material of the low-resistancemetal layer 36 may include copper (Cu), aluminum (Al), titanium aluminum(TiAl), cobalt tungsten phosphide (CoWP) or any combination thereof.Since the process of using RMG process to transform dummy gate intometal gate is well known to those skilled in the art, the details ofwhich are not explained herein for the sake of brevity.

Next, part of the work function metal layer 34 and low resistance metallayer 36 on the ILD layer 32 could be removed to form metal gates 18,20, 22, part of the metal gates 18, 20, 22 are removed by etching backprocess, and a hard mask 38 is formed on the metal gates 18, 20, 22 witha planarizing process thereafter. The hard mask 38 could be a singlematerial layer or composite material layer, such as a composite layercontaining both silicon oxide and silicon nitride, and the top surfaceof the hard mask 38 is preferably even with the top surface of the ILDlayer 32.

Next, as shown in FIG. 2, by using the difference in etching selectivitybetween the ILD layer 32 and the hard mask 38, spacer 24, and CESL 30,part of the ILD layer 32 between the metal gates 18, 20, 22 is removedto form a recess 40. An oxide layer 58 could then be depositedselectively on the hard mask 38 and ILD layer 32 to serve as an etchingstop layer, and a high resistance metal layer 42 and a dielectric stack44 are formed on the oxide layer 48. According to a preferred embodimentof the present invention, the high resistance metal layer 42 includesTiN, the dielectric stack 44 preferably serving as a mask layer couldinclude a silicon nitride layer 46 and a silicon dioxide layer 48, butnot limited thereto. Moreover, despite the depth of the recess 40 islower than the top surface of the hard mask 38 (or original surface ofthe ILD layer 32) and slightly higher than the bottom of the hard mask38, the depth of the recess 40 could also be adjusted according to thedemand of the product to be lower than the top surface of the hard mask38 while substantially even with or lower than the bottom surface of thehard mask 38, which is also within the scope of the present invention.

Next, as shown in FIG. 3, the dielectric stack 44 and the highresistance metal layer 42 are patterned to form a patterned dielectricstack 44 and a patterned high resistance metal layer 42 in the recess40. Preferably, the patterning of the dielectric stack 44 and highresistance metal layer 42 could be accomplished by first forming apatterned resist (not shown) on the dielectric stack 44, and a dryetching is conducted by using the patterned resist as mask to removepart of the dielectric stack 44 for forming patterned dielectric stack44 on the ILD layer 32 of the recess 40. Next, as shown in FIG. 4, theaforementioned patterned resist could be removed selectively by usingthe patterned dielectric stack 44 as etching mask, or performs a wetetching process by using the patterned resist as mask again to removepart of the high resistance metal layer 42 for forming patterned highresistance metal layer 42 so that both the patterned dielectric stack 44and patterned high resistance metal layer 42 are disposed on the ILDlayer 32 within the recess 40, in which the top surfaces of thepatterned dielectric stack 44 and patterned high resistance metal layer42 are both lower than the top surface of the hard mask 38.

Next, as shown in FIG. 5, another ILD layer 50 is formed on the oxidelayer 58, hard mask 38, ILD layer 32, patterned dielectric stack 44, andpatterned high resistance metal layer 42. In this embodiment, the ILDlayer 50 is preferably composed of same material as the ILD layer 32,such as TEOS.

Next, as shown in FIG. 6, a contact plug 52 is formed in the ILD layer50 and ILD layer 52 to electrically connect the source/drain region 26and epitaxial layer 28 adjacent to the metal gate 18, and anothercontact plug 54 is formed in the ILD layer 50 to electrically connectthe patterned high resistance metal layer 42 and a contact plug 56 inthe ILD layer 50 to electrically connect the metal gate 22. Theformation of the contact plugs 52, 54, 56 could be accomplished by firstforming a plurality of contact holes (not shown) in the ILD layers 32,selectively forming silicides on the surface of the source/drain region26 and epitaxial layer 28 exposed by the contact holes, and depositing abarrier/adhesive layer (not shown), a seed layer (not shown), and aconductive layer (not shown) into the contact holes, in which thebarrier/adhesive layer is conformally deposited into the contact holeswhile the conductive layer is filled the contact holes entirely. Thebarrier/adhesive layer may be consisted of tantalum (Ta), titanium (Ti),titanium nitride (TiN) or tantalum nitride (TaN), tungsten nitride (WN)or a suitable combination of metal layers such as Ti/TiN, but is notlimited thereto. A material of the seed layer is preferably the same asa material of the conductive layer, and a material of the conductivelayer may include a variety of low-resistance metal materials, such asaluminum (Al), titanium (Ti), tantalum (Ta), tungsten (W), niobium (Nb),molybdenum (Mo), copper (Cu) or the likes, preferably tungsten orcopper, and most preferably tungsten. Next, a planarizing process suchas CMP process and/or etching process to remove part of thebarrier/adhesive layer, seed layer, and conductive layer so that the topsurface of the remaining conductive layer is even with the top surfaceof the ILD layer to form contact plugs 52, 54, 56. This completes thefabrication of a semiconductor device according to a preferredembodiment of the present invention.

It should be noted that the formation of the contact holes (not shown)in the ILD layers 32 and 50 for fabricating contact plugs 52, 54, 56could be accomplished by an integration of double patterning technique.For instance, the fabrication of the contact plug 52 electricallyconnected to the source/drain region 26, the contact plug 54electrically connected to the patterned high resistance metal layer 42,and the contact plug 56 electrically connected to the metal gate 22could be adjusted depending on parameters such as etching depth, patterndensity, and aspect ratio. For instance, if same etching depth were tobe considered, the depth of the recess 40 could be adjusted to be evenwith or slightly lower than the bottom of the hard mask 38 so that thecontact holes (not shown) for forming contact plugs 54 and 56 could beformed at the same time in the ILD layer 50 without etching through thehigh resistance metal layer 42. Alternatively, if the depth of therecess 40 were to be adjusted to be substantially lower than the bottomof the hard mask 38 or substantially even with the epitaxial layer 28,contact holes (not shown) for forming contact plugs 52 and 54 could beformed simultaneously.

Referring again to FIG. 6, a semiconductor device structure is furtherdisclosed, in which the semiconductor device includes a substrate 12, aplurality of metal gates 18, 20, 22 on the substrate 12, a plurality ofhard masks 38 on the metal gates 18, 20, 22, an ILD layer including ILDlayer 32 and ILD layer 50 on the metal gates 18, 20, 22 and around eachmetal gate 18, 20, 22, and a patterned high resistance metal layer 42embedded in the ILD layers 32 and 50. A patterned dielectric stack 44 isdisposed on the patterned high resistance metal layer 42, in which thepatterned dielectric stack 44 includes silicon nitride and silicondioxide, and the patterned high resistance metal layer 42 includes TiN,but not limited thereto. In this embodiment, the top surface of thepatterned high resistance metal layer 42 is lower than the top surfaceof each hard mask 38, and the top surface of the patterned dielectricstack 44 thereon is also lower than the top surface of each hard mask38. Nevertheless, the position of the high resistance metal layer 42 anddielectric stack 44 could also be adjusted along with the depth of therecess 40 as disclosed previously, such that the top surfaces of bothlayers could be lower than the bottom surface of the hard mask 38, whichis also within the scope of the present invention.

The semiconductor device further includes a plurality of contact plugs52, 54, 56 electrically connected to the metal gates and high resistancemetal layer 42 respectively, in which the contact plug 52 embedded inthe ILD layers 32 and 50 is electrically connected to the source/drainregion 26 adjacent to the metal gate 18, the contact plug 54 embedded inthe ILD layers 32 and 50 is electrically connected to the patterned highresistance metal layer 42 and the contact plugs 56 in the ILD layer 50is electrically connected to the metal gate 22. It should be noted thateven though a STI composed of insulating layer 16 is disposed directlyunder the patterned high resistance metal layer 42, the location of theinsulating layer 16 could also be adjusted according to the demand ofthe product. For instance, no insulating layer 16 could be disposeddirectly under the patterned high resistance metal layer 42, which isalso within the scope of the present invention.

In addition to the embodiments disclosed in FIGS. 3-4, according toanother embodiment of the present invention, as shown in FIG. 7, itwould also be desirable to pattern the dielectric stack 44 and highresistance metal layer 42 by first forming a patterned resist (nowshown) with substantially greater width on the dielectric stack 44, andthen performing a dry etching process by using the patterned resist asmask to remove part of the dielectric stack 44 for forming a patterneddielectric stack 44 on the ILD layer 32 within the recess 40 and on atleast one side of the CESL 30, spacer 24, or part of the hard mask 38.Next, the patterned resist could be removed selectively or a wet etchingcould be conducted by using the patterned resist again as mask to removepart of the high resistance metal layer 42 so that both the patterneddielectric stack 44 and patterned high resistance metal layer 42 aredisposed on the ILD layer 32 and two sides of the CESL 30, spacer 24, orpart of the hard mask 38. Next, fabrication process from FIGS. 5-6 couldbe carried out to form another ILD layer 50 on the oxide layer 58, hardmask 38, ILD layer 32, patterned dielectric stack 44, and patterned highresistance metal layer 42, and a plurality of contact plugs 52, 54, 56are formed to electrically connect the source/drain region 26 andepitaxial layer 28, patterned high resistance metal layer 42, and metalgate 22. From a structural view, the patterned high resistance metallayer 42 is preferably embedded in the ILD layers 32 and 50, in whichthe patterned high resistance metal layer 42 includes a step profile onthe CESL 30, spacer 24, or part of the hard mask 38.

Overall, the present invention preferably forms hard mask on metalgates, uses the hard mask as etching mask to remove part of the ILDlayer to forma recess between the metal gates, and then forms a thinfilm resistor composed high resistance metal layer in the recess. Sincepart of the ILD layer has already been removed, the top surface of thehigh resistance metal layer would be substantially lower than the topsurface of the adjacent hard mask so that penetration of contact plugsthrough high resistance metal layer directly thereby affecting theperformance of thin film resistor could be prevented.

Those skilled in the art will readily observe that numerousmodifications and alterations of the device and method may be made whileretaining the teachings of the invention. Accordingly, the abovedisclosure should be construed as limited only by the metes and boundsof the appended claims.

What is claimed is:
 1. A semiconductor device, comprising: a substrate;a metal gate on the substrate; a hard mask on the metal gate; aninterlayer dielectric (ILD) layer around the metal gate; and a patternedmetal layer embedded in the ILD layer, wherein the patterned metal layercomprises a step directly on top of the hard mask and an absolute bottomsurface of the patterned metal layer is higher than a top surface of themetal gate.
 2. The semiconductor device of claim 1, further comprising apatterned dielectric stack on the patterned metal layer, wherein thepatterned dielectric stack comprises silicon nitride and silicondioxide.
 3. The semiconductor device of claim 1, wherein the step is onpart of the hard mask.
 4. The semiconductor device of claim 1, whereinthe patterned metal layer comprises TiN.
 5. The semiconductor device ofclaim 1, further comprising a shallow trench isolation (STI) in thesubstrate, wherein the patterned metal layer is on the STI.
 6. Thesemiconductor device of claim 5, wherein the STI is overlaid by thepatterned metal layer entirely.
 7. The semiconductor device of claim 1,wherein a top surface of the patterned metal layer is lower than a topsurface of the hard mask.
 8. The semiconductor device of claim 1,wherein the patterned metal layer is directly on top of the ILD layer.9. A semiconductor device, comprising: a substrate; a metal gate on thesubstrate; a hard mask on the metal gate; an interlayer dielectric (ILD)layer around the metal gate; a patterned metal layer embedded in the ILDlayer, wherein the patterned metal layer comprises a step directly ontop of the hard mask and a bottom surface of the patterned metal layeris higher than a top surface of the metal gate; and a patterneddielectric stack on the patterned metal layer, wherein the patterneddielectric stack comprises silicon nitride and silicon dioxide.
 10. Thesemiconductor device of claim 9, wherein the step is on part of the hardmask.
 11. The semiconductor device of claim 9, further comprising ashallow trench isolation (STI) in the substrate, wherein the patternedmetal layer is on the STI.
 12. The semiconductor device of claim 11,wherein the STI is overlaid by the patterned metal layer entirely. 13.The semiconductor device of claim 9, wherein a top surface of thepatterned metal layer is lower than a top surface of the hard mask. 14.The semiconductor device of claim 9, wherein the patterned metal layeris directly on top of the ILD layer.